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崗位職責(zé): 1.負(fù)責(zé)薄膜、黃光、蝕刻 、 離子擴(kuò)散、機(jī)械研磨等設(shè)備機(jī)臺(tái)的維護(hù)及效能精進(jìn)。 2.處理高科技設(shè)備故障。 3.改進(jìn)和提高設(shè)備的效率，設(shè)計(jì)新自動(dòng)化設(shè)備以提升工藝產(chǎn)能。 4.計(jì)劃和執(zhí)行分析或缺陷檢測(cè)項(xiàng)目。 5.與跨職能工程師或供應(yīng)商溝通。 1. Handle Diffusion, Thin Film, Lithography or Etching equipment. 2. Warm up and trouble solve with high tech. equipment. 3. Improve and enhance the efficiency of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross function engineers or vendors. 任職要求: 1.碩士上學(xué)歷。電子、電氣、機(jī)械及自動(dòng)化相關(guān)專業(yè)。 2.具備基本的機(jī)械相關(guān)知識(shí)。有半導(dǎo)體工藝知識(shí)者優(yōu)先。 3.具有嵌入式程序開發(fā)經(jīng)驗(yàn)或電路板設(shè)計(jì)經(jīng)驗(yàn)者優(yōu)先。 4.具備視覺開發(fā)coding能力，熟悉python、Halcon， Labview，OPENCV等開發(fā)軟件者優(yōu)先 5.良好的解決問題能力，溝通能力，團(tuán)隊(duì)精神，積極的學(xué)習(xí)態(tài)度，英語(yǔ)能力強(qiáng)。 6.可以適應(yīng)Fab內(nèi)的工作環(huán)境，接受大夜班，需配合低頻率輪班。 1. Bachelor degree and above. Major in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields. 2. No experience required (having experience with equipment maintenance or improvement is a plus). 3. Have basic mechanical related knowledge. Having the semiconductor processes knowledge is a plus. 4. Good problem solving skills, communication ability, team spirit, active learning attitude and is adequate in English.